Many patent technologies are used for HAIMOSIC products. We are constantly working on R&D to realize low inductance package in the world's top level.
The HAIMOSIC third-generation power module is very compact due to its built-in coreless current sensors.As a bolt-fastening type 6-in-1 power module, it achieves worldclass performance (low inductance). HAIMOSIC's power modules use proprietary patented technology that not only minimizes the inductance of the module itself but also incorporates a technique that partially cancels the total inductance of the inverter when the power module is assembled into it.HAIMOSIC's power module can accommodate S size/M size/L size SiC chips within a single package. By changing the configuration of the chips inside the module according to customer needs, a finely selectable current range of 330Arms to 650Arms (1200V) and 560Arms to 680Arms (750V) is available.
The fourth generation power module inherits the core technology of the third generation while adopting EPOXY molding and copper CLIP technology, improving the power cycle lifespan. Additionally, by using laser welding for terminal connections, it can reduce inductance compared to the third generation. Many technologies have been implemented to maximize the performance of ROHM's fifth generation chips. The module design is intended to allow switching to SiC chips up to the seventh generation inside the module. By updating the generation of SiC chips, it is possible to enhance the performance of the inverter.
HAIMOSIC is specialized in the development of vehicle specification level power module. Compared to general industrial power modules, multiple difficulties such as vibration, cooling, miniaturization and EMC are required to be solved. Although HAIMOSIC design and manufacture power modules, we also hold engineers who can design inverter for automobiles. Since we can design SiC drive circuits, we can provide design advise to the customers.
HAIMOSIC is capable of developing optimal packaging for ROHM SiC chips. Due to the deep understanding of ROHM SiC chip, the performance and the reliability of the chip installed in the module can be maximized.
HAIMOSIC closely integrates the two aspects of Quality Control at “The design stage" and “The production stage", to aim for world-class quality control of the product.
HAIMOSIC (SHANGHAI) CO.,LTD. is a Joint venture initiated by Zhenghai Group Co., Ltd. (China) and ROHM Co., Ltd. (Japan). HAIMOSIC is mainly engaged in the R&D, design, manufacturing and sales of the silicon carbide power module, with an estimated annual capacity of 360000 / year. The total investment of the project is 401million RMB and the registered capital is 250million RMB.
Date of EstablishmentJuly, 2021
Business DescriptionDevelopment, design, production, sales of power modules
Investment RatioZhenghai Sicron（100% subsidiary of Zhenghai Group）80％,ROHM 20％
1951 Wanfang Road, Pujiang Town, Minhang District, Shanghai
market@HAIMOSIC.com
021-60906296
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